Modeling the effect of barrier thickness and low-k dielectric on circuit reliability using 3D model

✍ Scribed by Feifei He; Cher Ming Tan

• Book ID: 108210894
• Publisher: Elsevier Science
• Year: 2010
• Tongue: English
• Weight: 816 KB
• Volume: 50
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/j.microrel.2010.07.111