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Modeling the curing kinetics for a modified bismaleimide resin using isothermal DSC

✍ Scribed by Zhan-Sheng Guo; Shan-Yi Du; Bo-Ming Zhang; Zhan-Jun Wu

Publisher: John Wiley and Sons
Year: 2004
Tongue: English
Weight: 107 KB
Volume: 92
Category: Article
ISSN: 0021-8995
DOI: 10.1002/app.20331

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