Modeling reactive wetting

✍ Scribed by J.A. Warren; W.J. Boettinger; A.R. Roosen

• Book ID: 104403528
• Publisher: Elsevier Science
• Year: 1998
• Tongue: English
• Weight: 795 KB
• Volume: 46
• Category: Article
• ISSN: 1359-6454
• DOI: 10.1016/s1359-6454(97)00487-4

✦ Synopsis

AbstractÐWhen a liquid alloy spreads on a metal substrate, interdiusion may result in partial dissolution of the substrate and/or formation of intermetallic phases. We investigate the former case and use a diusion/¯uid ¯ow analysis to describe the change in shape of the liquid±solid interface and the resultant motion of the triple junction along the substrate. Matching of ¯ux boundary conditions for the liquid surface and the liquid±solid interface at the triple junction lead to an expression for the speed of spreading. The governing equations, for a drop whose height is much smaller than its width, are solved numerically for a variety of conditions. The roles of chemical driving force, liquid±solid interface energy, and angles between the various boundaries are established. During rapid spreading, large variations in curvature of the liquid±solid interface near the triple junction can lead to experimentally measured apparent angles much dierent from those determined by capillarity.