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Modeling of Si Etching Under Effects of Plasma Molding in Two-Frequency Capacitively Coupled Plasma in $\hbox{SF}_{6}/\hbox{O}_{2}$ for MEMS Fabrication

✍ Scribed by Hamaoka, Fukutaro; Yagisawa, Takashi; Makabe, Toshiaki


Book ID
118194537
Publisher
IEEE
Year
2007
Tongue
English
Weight
896 KB
Volume
35
Category
Article
ISSN
0093-3813

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