Modeling of long-term creep behavior of structural epoxy adhesives

✍ Scribed by C.-W. Feng; C.-W. Keong; Y.-P. Hsueh; Y.-Y. Wang; H.-J. Sue

• Publisher: Elsevier Science
• Year: 2005
• Tongue: English
• Weight: 348 KB
• Volume: 25
• Category: Article
• ISSN: 0143-7496
• DOI: 10.1016/j.ijadhadh.2004.11.009

✦ Synopsis

The mechanical properties of polymeric materials change over time, especially when they are subjected to long-term loading regimes. It is imperative that reliable accelerated tests be developed to determine the long-term time-dependent performance of polymers under different environmental conditions. The long-term creep behaviors of a neat epoxy resin and a commercial structural adhesive for bonding aluminum substrates were investigated. The time-temperature superposition method produced a master curve, allowing for the long-term creep compliance to be estimated. The physics-based coupling model was utilized and found to fit well with the long-term creep master curve. The equivalence of the temperature and moisture effects on the creep compliance of the epoxy adhesives was also addressed. Finally, a methodology for predicting the long-term creep behavior of epoxy adhesives was proposed.