Modeling of Copper CMP Using the Colloidal Behavior of an Alumina Slurry with Copper Nanoparticles

✍ Scribed by Ihnfeldt, Robin; Talbot, Jan B.

• Book ID: 123617120
• Publisher: The Electrochemical Society
• Year: 2007
• Tongue: English
• Weight: 272 KB
• Volume: 154
• Category: Article
• ISSN: 0013-4651
• DOI: 10.1149/1.2789811