✦ LIBER ✦
Modeling of an oblique impact of solder droplet onto a groove with the impact point to be offset from the groove surfaces interface
✍ Scribed by Dewen Tian; Yanhong Tian; Chunqing Wang; Chunjin Hang
- Publisher
- Springer
- Year
- 2009
- Tongue
- English
- Weight
- 654 KB
- Volume
- 44
- Category
- Article
- ISSN
- 0022-2461
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