𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Modeling and simulation of non-uniformity in the planarization process

✍ Scribed by Thin-Lin Horng

Publisher
Springer
Year
2007
Tongue
English
Weight
493 KB
Volume
39
Category
Article
ISSN
0268-3768

No coin nor oath required. For personal study only.

πŸ“œ SIMILAR VOLUMES

Yield improvement in wafer planarization
Yield improvement in wafer planarization: Modeling and simulation
πŸ“‚ Article πŸ“… 2004 πŸ› Society of Manufacturing Engineers 🌐 English βš– 120 KB

Chemical mechanical polishing (CMP) is a planarization process that produces high-quality surfaces both locally and globally. CMP is one of the key process steps during the fabrication of very large scale integrated (VLSI) chips in integrated circuit manufacturing. CMP consists of a chemical process