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Modeling and simulation for a drop-impact analysis of multi-layered printed circuit boards

✍ Scribed by Yuqi Wang; K.H. Low; H.L.J. Pang; K.H. Hoon; F.X. Che; Y.S. Yong

Book ID: 108210559
Publisher: Elsevier Science
Year: 2006
Tongue: English
Weight: 936 KB
Volume: 46
Category: Article
ISSN: 0026-2714
DOI: 10.1016/j.microrel.2005.05.007

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