Mixed-mode effects on the toughness of polymer interfaces
β Scribed by H. R. Brown
- Publisher
- Springer
- Year
- 1990
- Tongue
- English
- Weight
- 596 KB
- Volume
- 25
- Category
- Article
- ISSN
- 0022-2461
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Accurate characterization of interfacial adhesion is essential for the development of reliable wafer bonding processes. In most applications in which wafers are bonded, the interface experiences a combination of shear and normal loading (i.e., mixed-mode loading). When characterizing the fracture pr
## Abstract The influences of loading rate and thickness on fracture behavior and mechanism of thermoset epoxy resin with polyamine hardener under mixedβmode (mode I/II) loading have been studied at low thickness and low loading rate (LTLL), as well as high thickness and high loading rate (HTHL). U