✦ LIBER ✦
Microvoid Formation at Solder–Copper Interfaces During Annealing: a Systematic Study of the Root Cause
✍ Scribed by Santosh Kumar; Joseph Smetana; David Love; James Watkowski; Richard Parker; Carol A. Handwerker
- Book ID
- 107457382
- Publisher
- Springer US
- Year
- 2011
- Tongue
- English
- Weight
- 648 KB
- Volume
- 40
- Category
- Article
- ISSN
- 0361-5235
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