Microcomponents and microdevices are increasingly finding application in everyday life. The specific functions of all modern microdevices depend strongly on the selection and combination of the materials used in their construction, i.e., the chemical and physical solid-state properties of these mate
Microsystem Technology
β Scribed by Wolfgang Menz, JΓΌrgen Mohr, Oliver Paul
- Publisher
- Wiley-VCH
- Year
- 2001
- Tongue
- English
- Leaves
- 514
- Edition
- 1
- Category
- Library
No coin nor oath required. For personal study only.
β¦ Synopsis
This completely revised edition of a bestselling concise introduction to microsystems technology includes the latest trends in this emerging scientific discipline. The chapters on silicium and LIGA technology are greatly expanded, whilst new topics include application aspects in medicine and health technology, lithography and electroplating.
π SIMILAR VOLUMES
<p>Microsystem technology (MST) integrates very small (up to a few nanometers) mechanical, electronic, optical, and other components on a substrate to construct functional devices. These devices are used as intelligent sensors, actuators, and controllers for medical, automotive, household and many o
<p><P><STRONG>Bonding in Microsystem Technology</STRONG> starts with descriptions of terminology, kinds of microsystems and market analysis. Followed by the presentation of mechanisms of wet etching, set of process parameters, description of micromachining methods, examples of procedures, process fl
Microcomponents and microdevices are increasingly finding application in everyday life. The specific functions of all modern microdevices depend strongly on the selection and combination of the materials used in their construction, i.e., the chemical and physical solid-state properties of these mate
<P><STRONG>Bonding in Microsystem Technology concerns the exciting field of microsystems (known under varying names as: MEMS, Β΅TAS (analytical or chemical Microsystems), MOEMS: the micro-miniature devices, utilizing extremely miniaturized mechanical structures made usually from silicon by wet deep
Microsystems technology is discussed from various perspectivesβa review of currently used microsystem techniques, a series of case studies dealing with major applications, and proposals for packaging, testing, reliability and failure analysis techniques, and CAO tools and methods.