✦ LIBER ✦
Microstructures and fatigue life of SnAgCu solder joints bearing Nano-Al particles in QFP devices
✍ Scribed by Zhang, Liang; Fan, Xi-ying; Guo, Yong-huan; He, Cheng-wen
- Book ID
- 125385168
- Publisher
- The Korean Institute of Metals and Materials
- Year
- 2014
- Tongue
- English
- Weight
- 369 KB
- Volume
- 10
- Category
- Article
- ISSN
- 1738-8090
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