<P>Microstructure, Property and Processing of Functional Ceramics describes the preparation, property and local structure microscopy of functional ceramics. It covers functional ceramic fabrication processing, grain boundary phenomena and micro-, nanoscale structures characterizations including scan
Microstructure, Property and Processing of Functional Ceramics
β Scribed by Qingrui Yin, Binghe Zhu, Huarong Zeng
- Year
- 2009
- Tongue
- English
- Leaves
- 342
- Edition
- 1
- Category
- Library
No coin nor oath required. For personal study only.
β¦ Synopsis
Microstructure, Property and Processing of Functional Ceramics describes the preparation, property and local structure microscopy of functional ceramics. It covers functional ceramic fabrication processing, grain boundary phenomena and micro-, nanoscale structures characterizations including scanning electron acoustic microscopy, scanning probe acoustic microscopy and piezoresponse force microscopy. This book is intended for advanced undergraduates, graduates and researchers in the field of materials science, microelectronics, optoelectronics and microscopy. Qingrui Yin and Binghe Zhu both are professors at the Shanghai Institute of Ceramics, Chinese Academy of Sciences; Dr. Huarong Zeng is an associate professor at the Shanghai Institute of Ceramics, Chinese Academy of Sciences.
β¦ Table of Contents
Cover Page
......Page 1
Front Page
......Page 2
Title Page......Page 3
Copyright Page......Page 4
Preface......Page 5
Acknowledgements......Page 7
Table of Contents......Page 8
1.1 General Description......Page 13
1. 2. 1 Grain category......Page 17
1. 2. 2 Grain properties......Page 21
1. 3. 1 Concepts of grain boundary structures......Page 25
1. 3. 2 Properties of grain boundary structures......Page 26
1. 3. 3 Nano grain boundary structures......Page 27
1.4 Pore Phases......Page 28
1.5 Domain Structure......Page 30
1. 6. 1 General......Page 39
1. 6. 2 Electric domain and internal stress......Page 40
1. 6. 3 PLZT ceramics and internal stress......Page 45
1. 6. 4 PTC ceramics and internal stress......Page 51
1. 6. 5 Aging......Page 52
1. 7. 1 Ordinary dielectric materials for capacitor......Page 53
1. 7. 2 Relaxor ferroelectric materials......Page 59
1. 7. 3 Microwave dielectric materials......Page 60
1.8 Piezoelectric Ceramics......Page 61
1. 8. 2 Properties of piezoelectric ceramics......Page 62
1. 9. 1 Microstructures of transparent ferroelectric ceramics......Page 65
1. 9. 2 Experimental method and two phases of PLZT ceramics......Page 67
1. 9. 3 Domain switching properties of PLZT ceramics......Page 69
1. 9. 4 Grain boundaries in PLZT ceramics......Page 79
2. 1 Introduction......Page 89
2. 2 Generalization of Grain Boundary......Page 92
2. 2. 1 Grain boundary structure......Page 93
2. 2. 2 Grain boundary properties......Page 95
2. 3. 1 Generalization......Page 96
2. 3. 2 Boundary layer capacitors......Page 99
2. 3. 3 PTC materials......Page 101
2. 3. 4 Magnetic ceramics......Page 104
2. 3. 5 ZnO varistor materials......Page 105
2. 3. 6 Other examples of segregation......Page 106
2. 4. 2 Grain boundary region of BaTiO3 ceramics......Page 111
2. 4 .3 Grain boundary region of PLZT ceramics......Page 112
2. 4. 4 Grain boundary region and stress......Page 116
2. 4. 5 βCore-shellβ structure......Page 118
2. 5. 1 Generalization......Page 120
2. 5. 2 Centripetal and acentric grain boundary migration......Page 121
2. 5. 3 Liquid phase and abnormal grain growth during sintering......Page 129
2. 6 Relation between Grain Boundary and Properties......Page 131
2. 6. 1 Influence on mechanical properties......Page 132
2. 6. 2 Influence on electric properties......Page 139
2. 7 Summary......Page 143
References......Page 145
3. 1 Introduction......Page 153
3.2 History and Development of Scanning Electron AcousticMicroscopy......Page 154
3. 3 Physical Principle of SEAM Imaging......Page 155
3. 4 Scanning Electron Acoustic Microscopy Image Processing System......Page 157
3. 5 Theory Studies of Electron-acoustic Imaging......Page 159
3. 6. 1 SEAM imaging features of ferroelectric domains......Page 161
3. 6. 2. 2 Ferroelectric BaTiO3 single crystal......Page 162
3. 6. 2. 3 Ferroelectric BaTiO3 ceramics......Page 165
3. 6. 4 Ferroelasitc NdP5O6 single crystal......Page 167
3. 7 Magnetic Domains in Austenitic Steel......Page 168
3. 8 Modulation Frequency Dependence of SEAM ImagingDomain Structures......Page 170
3. 9 Electric Field Dependence of SEAM Imaging Domains......Page 172
3.10 Temperature Dependence of Ferroelastic Domains in PMNPTSingle Crystals......Page 173
3. 11. 1 Residual stress distribution in Ti3N4 coatings......Page 177
3. 11. 2 Stress distribution in ferroelectric composites......Page 179
3. 11. 3 Stress distribution in Si3N4 and ZrSiO4 ceramics......Page 180
3. 11. 4 Stress distribution of Al metal......Page 182
3. 11. 5 Surface structures and internal defects in lead-freepiezoelectric ceramics......Page 183
3. 11. 6 Phase transitions in superconductor ceramics......Page 185
3. 12 Scanning Probe Acoustic Microscopy......Page 186
3. 12. 1 Tip-vibration mode scanning probe acoustic microscope......Page 187
A. Ferroelectric BaTiO3 ceramics (Liu, Heiderhoff, Abicht, et al, 2002)......Page 188
B. Ferroelectric (Pb, La)(Zr, Ti)O3 (PLZT) ceramics (Yin, Li, Zeng, et al, 2004)......Page 189
3. 12. 2 Sample-vibration mode scanning probe acoustic microscopy......Page 191
3.12.2.2 Low frequency scanning probe acoustic microscopy (LF-SPAM)......Page 192
A. Lead-free Bi4Ti3O12 piezoelectric ceramics (Zeng, Yu, Zhang, et al, 2005)......Page 193
C. Relaxor-type PMN-PT crystals and PLZT ceramics (Zeng, Yu, Li, et al, 2005)......Page 195
3. 12. 2. 4 Modulation frequency dependence of acoustic imaging (Zeng, Yu,Zhang, et al, 2005)......Page 198
3. 12. 2. 5 Multi-response of ferroelectric domains to local stress (Yu, Zeng,Ma, 2005)......Page 199
3. 12. 2. 6 Low-frequency acoustic imaging mechanisms (Zeng, Yu, Li, et al, 2005)......Page 201
References......Page 202
4. 1 Introduction......Page 206
4. 2 History and Development of Scanning Probe Microcopy......Page 207
4. 3. 1 Operation principle......Page 208
4. 3. 2. 1 Effective depth of electric field......Page 211
4. 3. 2. 3 Experimental parameters......Page 212
4. 4. 1. 1 Perovskite structure......Page 213
4. 4. 1. 2 Bismuth layer structure......Page 217
4. 4. 2. 1 Transparent materials......Page 218
4. 4. 2. 2 Lead-free piezoelectric ceramics......Page 221
A. Antiparallel ferroelectric domains......Page 224
B. Hierarchy domain structures......Page 225
C. Domain inhomogeneity......Page 229
D. Three-dimension polarization distribution......Page 231
E. Unusual piezoresponse at the 180domain wall for tetragonal PMN-PTcrystal......Page 233
4. 4. 3. 2 PZN-PT single crystal......Page 235
4. 5. 1 Domain writing......Page 238
4. 5. 2. 1 Polarization reversal behavior of ferroelectric thin film......Page 239
4. 5. 2. 2 Sidewise domain growth dynamics......Page 241
4. 5. 2. 3 Stress-induced domain switching behaviors......Page 244
4. 5. 2. 4 Polarization stabilization under vacuum field......Page 245
4. 6. 1 Bi4Ti3O12 lead-free ceramics......Page 250
4. 6. 2 PMN-PT single crystal......Page 252
References......Page 256
5. 1 Introduction......Page 260
5. 1. 1 Capacitor ceramics......Page 264
5. 1. 2 Ferrite ceramics......Page 265
5. 1. 3 Corundum ceramics......Page 266
5. 1. 5 PTC ceramics......Page 267
5. 1. 7 Superconductor ceramics......Page 268
5. 2 Raw Material and Powder Preparation......Page 269
5. 2. 1 Ball mill mixing and grinding......Page 270
5. 2. 2 Powder preparation by oxide methods......Page 271
5. 2. 3 Powder preparation by co-precipitation......Page 275
5. 2. 4 Powder preparation by sol-gel method......Page 276
5. 2. 5 Powder preparation by hydrothermal method......Page 277
5. 3 Shaping and Forming of Functional Ceramics......Page 278
5. 3. 1 Processing of thin films......Page 279
5. 3. 2. 1 Tape casting technique......Page 282
5. 3. 2. 2 Sol tape casting......Page 283
5. 3. 3. 2 Spray granulation......Page 284
5. 3. 4 Iso-static pressing......Page 288
5. 3. 5 Hot injection moulding......Page 289
5. 3. 6 Slip casting......Page 290
5. 4. 1. 1 Gas phase sintering......Page 291
5. 4. 1. 2 Solid phase sintering......Page 292
5. 4. 1. 3 Liquid phase sintering......Page 293
5. 4. 2 Sintering process......Page 294
5. 4. 3 Grain growth......Page 298
5. 4. 4 Abnormal grain growth......Page 299
5. 4. 5 The effects of pressure and atmosphere on sintering......Page 300
5. 4.6 Pressure sintering......Page 301
5. 4. 7 Micro-porosity sintering......Page 302
5. 4. 8 Microwave sintering......Page 303
5. 5 Mechanical Finishing......Page 304
5. 6 Electroding......Page 306
5. 6. 1 Electroding from silver paste (or fired on electrode)......Page 307
5. 6. 2 Electroding from nickel plating (Electroless nickel)......Page 309
5. 6. 3 Other electroding methods......Page 311
References......Page 312
6. 1 Evolution of Ceramics......Page 314
6.2 Development of Functional Ceramics and Relation with OtherFactors......Page 315
6. 3 Importance and Complexity of Understanding FunctionalCeramic Effects and Mechanism......Page 319
6. 4 Emphasis of Ceramic Processing......Page 321
6. 5 Future Development of Functional Ceramics......Page 322
6. 5. 1 Dielectric ceramics and devices......Page 323
6. 5. 2 Chip type ceramic devices......Page 324
6. 5. 3 High performance, high temperature piezoelectric ceramics......Page 325
6. 5. 4 Lead-free piezoelectric ceramics......Page 326
6. 5. 5 Thermoelectric ceramics......Page 327
6. 5. 6 Functional ceramic films......Page 329
6. 5. 7. 1 Large size (Larger than 101.6 mm) lithium tetraborate piezoelectriccrystal......Page 333
6. 5. 7. 3 H-SiC crystal......Page 334
6. 5. 8. 1 Battery material and secondary battery......Page 335
6. 5. 8. 2 Fuel cell......Page 336
6. 5. 10 Fabrication of ceramic micro-components......Page 337
References......Page 339
Index......Page 341
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