✦ LIBER ✦
Microstructure, Intermetallic Growth, and Reliability of Rapidly Solidified Pb-Free Solder Joints Formed via Solder Ball Jetting
✍ Scribed by John L. Wagner; Peter F. Ladwig; Doug P. Riemer; Galen Houk
- Book ID
- 107455587
- Publisher
- Springer US
- Year
- 2009
- Tongue
- English
- Weight
- 735 KB
- Volume
- 38
- Category
- Article
- ISSN
- 0361-5235
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