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Microstructure formation on low temperature co-fired ceramic green substrates using micro embossing

โœ Scribed by Xuechuan Shan; H. P. Maw; R. T. Tjeung; S. H. Ling; C. W. Lu; R. Jachowicz


Publisher
Springer-Verlag
Year
2008
Tongue
English
Weight
409 KB
Volume
14
Category
Article
ISSN
0946-7076

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The frequency-dependent maximum average power-handling capabilities (APHCs) of single and edge-coupled microstrip lines (MLs) on low-temperature co-fired ceramic (LTCC) substrates are investigated in this article. Although LTCCs have excellent high-frequency performance, the thermal conductivity is