✦ LIBER ✦
Microstructure evolution and resistivity of Cu(B) alloy films on Ti underlayer at the early stage of annealing at 500°C
✍ Scribed by T. K. Hong; S. Lee; D. M. Han; J. G. Lee; J. H. Lee; D. H. Kim; C. O. Jeong; H. Ruh; E. G. Lee; C. H. Kang
- Book ID
- 111857167
- Publisher
- TechnoPress
- Year
- 2008
- Tongue
- English
- Weight
- 538 KB
- Volume
- 14
- Category
- Article
- ISSN
- 1598-9623
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