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Microstructure-electromigration correlation in a thin stripe of eutectic SnPb solder stressed between Cu electrodes
✍ Scribed by Liu, C. Y.; Chen, Chih; Liao, C. N.; Tu, K. N.
- Book ID
- 120352755
- Publisher
- American Institute of Physics
- Year
- 1999
- Tongue
- English
- Weight
- 559 KB
- Volume
- 75
- Category
- Article
- ISSN
- 0003-6951
- DOI
- 10.1063/1.124276
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