Microstructure Changes and Physical Properties of the Intermetallic Compounds Formed at the Interface Between Sn-Cu Solders and a Cu Substrate Due to a Minor Addition of Ni

✍ Scribed by Petr Harcuba; Miloš Janeček

• Publisher: Springer US
• Year: 2010
• Tongue: English
• Weight: 434 KB
• Volume: 39
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-010-1373-3