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Microstructure and thermal conductivity of submicron Si3N4 reinforced 2024Al composite

✍ Scribed by Wen-shu YANG; Zi-yang XIU; Guo-qin CHEN; Gao-hui WU


Book ID
117694182
Publisher
Elsevier Science
Year
2009
Tongue
English
Weight
513 KB
Volume
19
Category
Article
ISSN
1003-6326

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