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Microstructure and thermal conductivity of copper matrix composites reinforced with mixtures of diamond and SiC particles

✍ Scribed by Yuanyuan Han; Hong Guo; Fazhang Yin; Ximin Zhang; Ke Chu; Yeming Fan


Book ID
113107586
Publisher
Nonferrous Metals Society of China
Year
2012
Tongue
English
Weight
449 KB
Volume
31
Category
Article
ISSN
1001-0521

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