Microstructure and spacings of directionally solidified metal-semiconductor eutectic alloys
✍ Scribed by Dr. rer. nat. J. Vetter; Dr.-Ing J. Frühauf; Dr. rer. nat. G. Schmidt
- Publisher
- John Wiley and Sons
- Year
- 1985
- Tongue
- English
- Weight
- 532 KB
- Volume
- 20
- Category
- Article
- ISSN
- 0232-1300
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## Abstract The influence of various alloy elements on tensile strength of the eutectic, directionally solidified superalloy 73 C was determined. The tensile properties of the base alloy had been increased by Al, Y and C as alloying elements, while Ni and Ti showed a decreasing effect (alloy soften
The Inor1)liolog-y of t h e solid-liquid interface antl t h e nietal phase grain tlianieter of A--Sit y p e eutectics (At-Si, Ag-Si, Ag-Ge, Zn-Ge) were investigated i n t h e range of a growth r a t e A' = 0.2 ... 20 mm/h antl of a temperature gradient a t t h e solid-liquid interfact: G = = 2 ... 2