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Microstructure and room temperature hardening of ultra-fine-grained oxide-dispersion strengthened copper prepared by cryomilling

✍ Scribed by D.V. Kudashov; H. Baum; U. Martin; M. Heilmaier; H. Oettel


Publisher
Elsevier Science
Year
2004
Tongue
English
Weight
181 KB
Volume
387-389
Category
Article
ISSN
0921-5093

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