Microstructure and Residual Stress of Alumina Scale Formed on Ti2AlC at High Temperature in Air

✍ Scribed by J. W. Byeon; J. Liu; M. Hopkins; W. Fischer; N. Garimella; K. B. Park; M. P. Brady; M. Radovic; T. El-Raghy; Y. H. Sohn

• Publisher: Springer-Verlag
• Year: 2007
• Tongue: English
• Weight: 788 KB
• Volume: 68
• Category: Article
• ISSN: 0030-770X
• DOI: 10.1007/s11085-007-9063-0