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Microstructure and mechanical properties of aluminum–germanium eutectic bonding with polysilicon metallization for microelectromechanical systems (MEMS) packaging

✍ Scribed by Woo-Tae Park; Jin-Wook Jang; Troy Clare; Lianjun Liu


Book ID
113898856
Publisher
Elsevier Science
Year
2011
Tongue
English
Weight
462 KB
Volume
64
Category
Article
ISSN
1359-6462

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