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Microstructure and fracture toughness of liquid-phase-sintered β-SiC containing β-SiC whiskers as seeds

✍ Scribed by Shin-Han Kim; Young-Wook Kim; Mamoru Mitomo


Book ID
110425601
Publisher
Springer
Year
2003
Tongue
English
Weight
987 KB
Volume
38
Category
Article
ISSN
0022-2461

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