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Microstructure and conductivity of Cu-Nb microcomposites fabricated by the bundling and drawing process

✍ Scribed by S.I Hong; M.A Hill

Book ID: 114386319
Publisher: Elsevier Science
Year: 2001
Tongue: English
Weight: 355 KB
Volume: 44
Category: Article
ISSN: 1359-6462
DOI: 10.1016/s1359-6462(01)00665-0

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