Microstructural Modulations Enhance the Mechanical Properties in Al–Cu–(Si, Ga) Ultrafine Composites

✍ Scribed by Jin Man Park; Simon Pauly; Norbert Mattern; Do Hyang Kim; Ki Buem Kim; Jürgen Eckert

• Book ID: 101414645
• Publisher: John Wiley and Sons
• Year: 2010
• Tongue: English
• Weight: 374 KB
• Volume: 12
• Category: Article
• ISSN: 1438-1656
• DOI: 10.1002/adem.201000155

✦ Synopsis

Abstract

Adding small amounts of Si or Ga (3 at.%) to the eutectic Al~83~Cu~17~ alloy yields an ultrafine bimodal eutectic composite microstructure upon solidification. The as‐solidified alloys exhibit a distinct microstructural length‐scale hierarchy leading to a high fracture strength of around 1 GPa combined with a large compressive plastic strain of up to 30% at room temperature. The present results suggest that the mechanical properties of the ultrafine bimodal eutectic composites are strongly related to their microstructural characteristics, namely phase evolution, length‐scales, and distribution of the constituent phases.