Microstructural evolution during grain boundary engineering of low to medium stacking fault energy fcc materials

✍ Scribed by Mukul Kumar; Adam J. Schwartz; Wayne E. King

• Book ID: 108491868
• Publisher: Elsevier Science
• Year: 2002
• Tongue: English
• Weight: 674 KB
• Volume: 50
• Category: Article
• ISSN: 1359-6454
• DOI: 10.1016/s1359-6454(02)00090-3