✦ LIBER ✦
Microstructural development during fatigue of copper foils 20–100 μm thick : Judelewicz, M., Kunzi, H.-U., Merk, N. and Ilschner, B. Mater. Sci. Eng. A (15 Oct. 1994) 186 (1–2), 135–142
- Book ID
- 103548958
- Publisher
- Elsevier Science
- Year
- 1996
- Tongue
- English
- Weight
- 174 KB
- Volume
- 18
- Category
- Article
- ISSN
- 0142-1123
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