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Microsample tensile testing of nanocrystalline copper

โœ Scribed by Y.M. Wang; K. Wang; D. Pan; K. Lu; K.J. Hemker; E. Ma


Book ID
114387403
Publisher
Elsevier Science
Year
2003
Tongue
English
Weight
409 KB
Volume
48
Category
Article
ISSN
1359-6462

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