𝔖 Bobbio Scriptorium
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Microelectronic interconnection bonding with ribbon wire: byH. K. Kessler and A. H. Sher. National Bureau of Standards Technical Note 767, issued April 1973; 24 pp., 50 cents. (Order prepaid from the Superintendent of Documents, U.S. Government Printing Office, Washington, D.C. 20402, or local U.S. Department of Commerce Field Offices, as SD Catalog No. C13.36; 767.)

✍ Scribed by G.W.A.D.


Book ID
103269238
Publisher
Elsevier Science
Year
1973
Tongue
English
Weight
75 KB
Volume
12
Category
Article
ISSN
0026-2714

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