𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Microdielectric study of epoxy-amine systems: Gelation and relationships between conductivity and kinetics

✍ Scribed by Eloundou, Jean Pascal ;Gérard, Jean François ;Pascault, Jean Pierre ;Boiteux, Gisèle ;Seytre, Gérard

Publisher
John Wiley and Sons
Year
1998
Tongue
English
Weight
155 KB
Volume
263
Category
Article
ISSN
0003-3146

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Simultaneous kinetic and microdielectric
Simultaneous kinetic and microdielectric studies of some epoxy–amine systems
✍ Jean Pascal Eloundou; Ohandja Ayina; Hippolyte Ntede Nga; Jean François Gerard; 📂 Article 📅 1998 🏛 John Wiley and Sons 🌐 English ⚖ 233 KB 👁 1 views

Three reactive epoxy-amine systems based on diglycidyl ether of bisphenol A (DGEBA) with 4,4Ј-diaminodiphenylsulfone (DDS), 4,4Ј-methylenebis [3-chloro 2,6diethylaniline] (MCDEA), and 4,4Ј-methylenebis [2,6-diethylaniline] (MDEA), were studied during isothermal curings at 140 and 160°C. The simultan

Kinetics and thermal characterization of
Kinetics and thermal characterization of epoxy-amine systems
✍ Mangeng Lu; Sangwook Kim 📂 Article 📅 1999 🏛 John Wiley and Sons 🌐 English ⚖ 179 KB 👁 2 views

The curing behavior of epoxy resins was analyzed based on a simple kinetic model. We simulated the curing kinetics and found that it fits the experimental data well for both diglycidylether of bisphenol A-4,4Ј-methylene dianiline and diglycidylether of bisphenol A-carboxyl-terminated butadiene acryl

Kinetics and curing mechanism of epoxy a
Kinetics and curing mechanism of epoxy and boron trifluoride monoethyl amine complex system
✍ Ye-Shiu Li; Ming-Shiu Li; Feng-Chih Chang 📂 Article 📅 1999 🏛 John Wiley and Sons 🌐 English ⚖ 264 KB 👁 1 views

The kinetics of cationic polymerization of epoxy resin has been studied. Due to multiple reaction exotherms and irregular baselines involved in this system, the ASTM E 698 method was chosen to determine the kinetic parameters of this epoxy/ BF 3 -MEA system. The DER 332/BF 3 -MEA system follows the

Relationships between thermally induced
Relationships between thermally induced residual stresses and architecture of epoxy-amine model networks
✍ Didier Bauchiere; Jean Louis Halary; Lucien Monnerie; Robert Schirrer 📂 Article 📅 2000 🏛 John Wiley and Sons 🌐 English ⚖ 251 KB 👁 1 views

The capability of epoxy-amine resins to develop residual stresses was studied as a function of temperature and network architecture. These residual stresses were induced while cooling epoxy-glass bilayers from temperatures higher than the network glass transition temperature, T g . This behavior was

Cure modeling and monitoring of epoxy/am
Cure modeling and monitoring of epoxy/amine resin systems. I. Cure kinetics modeling
✍ Panagiotis I. Karkanas; Ivana K. Partridge 📂 Article 📅 2000 🏛 John Wiley and Sons 🌐 English ⚖ 276 KB 👁 2 views

The cure kinetics of four epoxy/amine systems including commercial RTM6 and F934 resins have been investigated under both isothermal and dynamic curing conditions. Differential Scanning Calorimetry (DSC) was the thermoanalytical technique used to determine the cure kinetics of these resin systems. T