✦ LIBER ✦
Micro-scale metallization of high aspect-ratio Cu and Au lines on flexible polyimide substrate by electroplating using SU-8 photoresist mask
✍ Scribed by S.H. Cho; S.H. Kim; J.G. Lee; N.-E. Lee
- Book ID
- 108207376
- Publisher
- Elsevier Science
- Year
- 2005
- Tongue
- English
- Weight
- 486 KB
- Volume
- 77
- Category
- Article
- ISSN
- 0167-9317
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