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Method of testing strength of portions bonded with adhesives. (Measures compliance of bonded portions by means of variable ultrasonic wave): Toshiba Denki KK Japanese Patent JPC 14670/69 (30 June 1969) (applied for 14 June 1961)


Publisher
Elsevier Science
Year
1969
Weight
128 KB
Volume
2
Category
Article
ISSN
0029-1021

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