✦ LIBER ✦
Method for determining structural defects in semiconductor wafers by ultrasonic microscopy : General Electric Company U.S. Patent No. 4,741,212 (3 May 1988)
- Book ID
- 103714402
- Publisher
- Elsevier Science
- Year
- 1990
- Weight
- 170 KB
- Volume
- 23
- Category
- Article
- ISSN
- 0308-9126
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