✦ LIBER ✦
Metallic bonding methodology for heterogeneous integration of optoelectronic dies to CMOS circuits
✍ Scribed by P. Robogiannakis; E.D. Kyriakis-Bitzaros; K. Minoglou; S. Katsafouros; A. Kostopoulos; G. Konstantinidis; G. Halkias
- Book ID
- 104051914
- Publisher
- Elsevier Science
- Year
- 2008
- Tongue
- English
- Weight
- 303 KB
- Volume
- 85
- Category
- Article
- ISSN
- 0167-9317
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