✦ LIBER ✦
Metal migration (Ag, Cu, Pb) in encapsulated modules and time-to-fail model as a function of the environment and package properties : G. Digiacomo. Proc. IEEE Reliab. Phys. Symp., 27 (1982)
- Publisher
- Elsevier Science
- Year
- 1983
- Tongue
- English
- Weight
- 112 KB
- Volume
- 23
- Category
- Article
- ISSN
- 0026-2714
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