✦ LIBER ✦

Melting Point Apparatus with Rapid Mechanical Stirring

✍ Scribed by Markley, K. S.

Book ID: 127022326
Publisher: American Chemical Society
Year: 1934
Weight: 155 KB
Volume: 6
Category: Article
ISSN: 0096-4484
DOI: 10.1021/ac50092a044

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Mechanically stirred melting-point tube

✍ Degering, Edward F. 📂 Article 📅 1932 🏛 American Chemical Society 🌐 English ⚖ 288 KB

Gas content in apparatus with mechanical

Gas content in apparatus with mechanical stirring at high-power consumptions

✍ A. M. Tsirlin; V. N. Trushanov; G. Ya. Khodov; R. A. Rabinovich 📂 Article 📅 1974 🏛 Springer 🌐 English ⚖ 239 KB

THOMAS-Hoover CAPILLARY MELTING POINT AP

THOMAS-Hoover CAPILLARY MELTING POINT APPARATUS with PERISCOPIC THERMOMETER READER

📂 Article 📅 1959 🏛 American Chemical Society 🌐 English ⚖ 82 KB

Evaluation of mettler automatic dropping

Evaluation of mettler automatic dropping point apparatus and statistical comparison with wiley melting point method

✍ W. G. Doeden 📂 Article 📅 1975 🏛 Springer-Verlag 🌐 English ⚖ 469 KB

Irreversibility, mechanical entanglement

Irreversibility, mechanical entanglement and thermal melting in superconducting vortex crystals with point impurities

✍ Deniz Ertaş; David R. Nelson 📂 Article 📅 1996 🏛 Elsevier Science 🌐 English ⚖ 598 KB

Electrical and mechanical characterizati

Electrical and mechanical characterization of an anisotropic conductive adhesive with a low melting point solder

✍ Yong-Sung Eom; Keonsoo Jang; Jong-Tae Moon; Jae-Do Nam; Jong-Min Kim 📂 Article 📅 2008 🏛 Elsevier Science 🌐 English ⚖ 282 KB

For the highly reliable interconnection in a micro-packaging technology requiring an excellent electrical and mechanical performance, the new anisotropic conductive adhesive (ACA) system with a low melting point solder was designed and characterized. An optimum flip-chip bonding cycle considering th