✦ LIBER ✦
Mechanical stability of PECVD silicon nitride protective films over bondwires, bonds and bondpads during thermal stress
✍ Scribed by R.K. Ulrich; A.J. Phillips; D.H. Yi; W.D. Brown; S.S. Ang
- Publisher
- Elsevier Science
- Year
- 1991
- Tongue
- English
- Weight
- 679 KB
- Volume
- 31
- Category
- Article
- ISSN
- 0026-2714
No coin nor oath required. For personal study only.