✦ LIBER ✦

Mechanical property evaluation of TSV-Cu micropillar by compression method

✍ Scribed by Ting Gu,Ping Cheng,Su Wang,Huiying Wang,Xuhan Dai…

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Mechanical properties of Cu6Sn5 intermet

✍ L. Jiang; N. Chawla 📂 Article 📅 2010 🏛 Elsevier Science 🌐 English ⚖ 580 KB

The Effect of Crystallographic Orientati

✍ Ling Jiang, Hanqing Jiang, Nikhilesh Chawla 📂 Article 📅 2012 🏛 Springer US 🌐 English ⚖ 917 KB

Mechanical properties of Cu electroplate

✍ Kinashi, Hikaru; Nagoshi, Takashi; Chang, Tso-Fu Mark; Sato, Tatsuo; Sone, Masat 📂 Article 📅 2014 🏛 Elsevier Science 🌐 English ⚖ 896 KB

Microstructure and mechanical property o

✍ L.C. Feng; W.Z. Shao; L. Zhen; N. Xie 📂 Article 📅 2008 🏛 Elsevier Science 🌐 English ⚖ 473 KB

Properties of W–Cu composite powder prod

✍ Yunping Li; Xuanhui Qu; ZhouShun Zheng; Changmin Lei; Zhiqiang Zou; Shu Yu 📂 Article 📅 2003 🏛 Elsevier Science 🌐 English ⚖ 553 KB

Evaluation of mechanical properties of p

✍ S. W. Youn; C. G. Kang 📂 Article 📅 2004 🏛 The Minerals, Metals & Materials Society 🌐 English ⚖ 936 KB