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Mechanical properties of plasma polymer film evaluated by conventional and alternative nanoindentation techniques

✍ Scribed by R. Trivedi; V. Cech

Publisher
Elsevier Science
Year
2010
Tongue
English
Weight
282 KB
Volume
205
Category
Article
ISSN
0257-8972

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✦ Synopsis

A plasma-polymerized tetravinylsilane film of about 1 ΞΌm thickness was prepared under steady-state deposition conditions on polished silicon wafer using plasma-enhanced chemical vapor deposition. Nearsurface mechanical properties such as the reduced modulus and hardness of the plasma polymer film were investigated using conventional depth-sensing nanoindentation as well as load-partial-unload (cyclic) nanoindentation. The study found an influence of the dwell time and loading/unloading rate on the determined values of the reduced modulus, hardness, and contact depth.

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