Mechanical etching of micro pockets by powder blasting
β Scribed by D.S. Park; T.I. Seo; M.W. Cho
- Publisher
- Springer
- Year
- 2004
- Tongue
- English
- Weight
- 511 KB
- Volume
- 25
- Category
- Article
- ISSN
- 0268-3768
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Brittle materials such as semiconductors, ceramics, glasses, piezoelectric etc., are difficult to machine by traditional machining methods. This paper provides an approach to create holes or grooves more efficiently via powder blasting process. Instead of one protective layer for mask that is conven
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