Mechanical behavior of Au–In intermetallics for low temperature solder diffusion bonding

✍ Scribed by Jie Lian; Steven Jan Wo Chun; Mark S. Goorsky; Junlan Wang

• Book ID: 106395195
• Publisher: Springer
• Year: 2009
• Tongue: English
• Weight: 536 KB
• Volume: 44
• Category: Article
• ISSN: 0022-2461
• DOI: 10.1007/s10853-009-3851-7