## Abstract In this study, 3,3′‐dinitrobenzidine was first reacted with excess isophthaloyl chloride to form a monomer with dicarboxylic acid end groups. Two types of aromatic dianhydride, [viz., pyromellitic dianhydride (PMDA) and 3,3′,4,4′‐sulfonyldiphthalic anhydride (DSDA)] also were reacted wi
Mechanical and thermal properties of ceramic-modified poly(amide imide)
✍ Scribed by Young-Wook Park; Dong-Sung Lee
- Publisher
- John Wiley and Sons
- Year
- 2004
- Tongue
- English
- Weight
- 135 KB
- Volume
- 94
- Category
- Article
- ISSN
- 0021-8995
No coin nor oath required. For personal study only.
✦ Synopsis
Abstract
Poly(amide imide)–epoxysilane (coupling agent) composites were reacted with silica, a condensation product of tetraethylorthosilicate (TEOS), by a sol–gel process and were then cast into films. After this procedure, the chemical characteristics and mechanical and thermal properties were measured. Fourier transform infrared showed that silica existed in the poly(amide imide) matrix. When a proper amount of silica was added to the poly(amide imide) matrix, the tensile strength, elongation, and toughness increased greatly. A poly(amide imide)/30 wt % epoxysilane composite with 20 wt % TEOS had the best mechanical properties. Thermogravimetric analysis under nitrogen and oxygen atmospheres indicated that the char contents increased with the amount of silica. The glass‐transition temperatures of the poly(amide imide)–silica nanocomposites were observed around 170–180°C with differential scanning calorimetry. This approach may be a new method for the low‐temperature thermal curing of poly(amide imide). © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 94: 1780–1788, 2004
📜 SIMILAR VOLUMES
A new class of poly(amide-imide-urethane) thermoplastic elastomers based on two-step synthesis of 4,4@-methylene bis(4-phenylisocyanate) with di †erent polyols (PPG and PTMG) and trimellitic anhydride was synthesized. Both resulting polymers showed semicrystalline structures and were readily soluble
## Abstract A series of hybrid materials incorporating imide‐modified silica (IM‐silica) network structures into a polyimide (PI) matrix were produced with a sol–gel technique from solution mixtures of poly(amic acid) and tetraethoxysilane (TEOS) containing alkoxysilane‐terminated amic acids with v
The influence of the molecular structure of five soluble poly(amide imide)s (PAI)s on their gas transport properties for carbon dioxide, oxygen, nitrogen, and methane has been studied. Permeabilities, diffusivities, and solubilities were determined by time lag measurements and correlated to chain pa