Mechanical and electrical evaluation of a bumped-substrate die-level burn-in : PATRICK THOMPSON et al. IEEE Transactions on Components, Packaging and Manufacturing Technology, Part B, 18(2), 264 (May 1995)

• Publisher: Elsevier Science
• Year: 1996
• Tongue: English
• Weight: 232 KB
• Volume: 36
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(96)84469-6