Mechanical and electrical bonding between silicon wafer and glass wafer with etched channels containing metal tracks

✍ Scribed by S. Brida; S. Metivet; D. Petit; O. Stojanovic

• Publisher: Springer-Verlag
• Year: 2005
• Tongue: English
• Weight: 309 KB
• Volume: 12
• Category: Article
• ISSN: 0946-7076
• DOI: 10.1007/s00542-005-0004-z