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Measurement of three dimensional stress and modeling of stress induced migration failure in aluminum interconnects : Atsumu Texaki, Takashi Meneta, Hidemitsu Egawa and Tatsuo Noguchi. 28th A. Proc. Reliab. Phys. Symp. (IEEE), 221 (March 1990)


Book ID
103283020
Publisher
Elsevier Science
Year
1991
Tongue
English
Weight
131 KB
Volume
31
Category
Article
ISSN
0026-2714

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