✦ LIBER ✦
Measurement of thermal resistance of first-level Cu substrate used in high-power multi-chips LED package
✍ Scribed by C.T. Yang; W.C. Liu; C.Y. Liu
- Book ID
- 113800476
- Publisher
- Elsevier Science
- Year
- 2012
- Tongue
- English
- Weight
- 636 KB
- Volume
- 52
- Category
- Article
- ISSN
- 0026-2714
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