Measurement of the interfacial strength of fibers and thin films
โ Scribed by W. Sachse
- Publisher
- Elsevier Science
- Year
- 1990
- Tongue
- English
- Weight
- 624 KB
- Volume
- 126
- Category
- Article
- ISSN
- 0921-5093
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โฆ Synopsis
This paper briefly summarizes several promising new mechanical as well as thermal means for initiating the debonding of a fiber in a matrix or a metal film on a substrate of a composite structure. Also described are quantitative electrical and acoustic (ultrasonic) techniques for monitoring the failure of this interface and for recovering an interfacial strength parameter. The focus is on practical bond strength measurement techniques which are accurate, reproducible and reasonably simple to carry out.
๐ SIMILAR VOLUMES
Measurements of the interfacial properties between an elastic tape and poly(methyl methylcrylate) substrates were carried out using a circular blister test. All properties, including adhesive fracture energy G a , residual stress o and the elastic modulus of the tapes can be deduced in a single test